Wednesday 8 January 2020

FILLER MATERIAL FOR JOINING DIAMOND TO STEEL SUBSTRATE

AMITAVA GHOSH, PRITHVIRAJ MUKHOPADHYAY and D.RAGHAVA SIMHAN have published for grant of patent, an invention that proposes a novel formulation of the brazing filler material that contains small weight percentage of an active element in the form of TiH2 added to eutectic composition of Ag-Cu alloy with the secondary reinforcement agents like hard particles of either nano-diamond or micro-TiC particles which aids in this new filler material formulation. The novel formulations shall  considerably ameliorate the abrasion resistance property of the filler material and ensure good diamond brazing with steels.

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